1. Laser machining of materials

    A device for machining a material with ultrashort laser pulses is described. This device comprises: (a) a device (1) for generating a sequence of first laser pulses, where the first laser pulses each have a duration of less than 300 picoseconds and the repetition rate for the first laser pulses is in the range between 100 kHz and 1 GHz, (b) a converter (2) for converting a first set of the sequence of first laser pulses into a sequence of second laser pulses for application to and for machining of the material, where the second laser pulses each have a ...
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